Reported Q: Q3 2024 Rev YoY: -4.9% EPS YoY: +198.9% Move: +2.82%
Kulicke and Soffa
KLIC
$72.92 2.82%
Exchange NASDAQ Sector Technology Industry Semiconductors
Q3 2024
Published: Aug 7, 2024

Company Status Snapshot

Fast view of the latest quarter outcome for KLIC

Reported

Report Date

Aug 7, 2024

Quarter Q3 2024

Revenue

181.65M

YoY: -4.9%

EPS

0.22

YoY: +198.9%

Market Move

+2.82%

Previous quarter: Q2 2024

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Earnings Highlights

  • Revenue of $181.65M down 4.9% year-over-year
  • EPS of $0.22 increased by 198.9% from previous year
  • Gross margin of 46.6%
  • Net income of 12.26M
  • "Gartner recently projected a 17% semiconductor revenue industry growth rate through calendar year 2025. This growth expectation seems very reasonable considering ongoing global front end investments, and is expected to be led primarily by AI, automotive and general semiconductor, which we expect will directly benefit the company and its investors." - Fusen Chen
KLIC
Company KLIC

Executive Summary

Kulicke and Soffa (KLIC) reported fiscal Q3 2024 revenue of $181.65 million with a gross margin of 46.6%, delivering GAAP net income of $12.26 million or $0.22 per share. The quarter benefited from a notable year-to-date 42% improvement in Ball Bonding and continued resilience in the Aftermarket/APS segments, even as some wedge and automotive/industrial demand faced headwinds earlier in the year. Management highlighted ongoing utilization improvements across multiple end markets and added a roughly $20 million Thermo-Compression contribution, including an additional Fluxless Thermocompression (FTC) system milestone. The company reaffirmed guidance for Q4 (September quarter) of approximately $180 million in revenue with ~47% gross margin and outlined a path to a broader multi-market recovery into calendar 2025, supported by Gartner’s 17% projected semiconductor revenue growth and rising utilization from high-70% levels toward the 80%+ target in key markets.

Strategically, KLIC emphasizes its expanding Thermo-Compression portfolio, Fluxless TCB leadership, and multi-die/stacked-die solutions as core drivers of long‑term value. The balance sheet remains robust, with substantial net cash and a disciplined capital deployment program including open-market share repurchases and a dividend program. While near-term demand remains uneven across end markets, the company is positioned to benefit from improving General Semiconductor dynamics, emerging opportunities in AI/HPC/mobility, and a strengthening memory packaging moat via chiplet-enabled interconnects.

In sum, Q3 marks a constructive inflection in profitability and cash generation, underpinned by a diversified portfolio of high‑margin, high‑growth packaging solutions. The key question for investors is the pace and breadth of the 2025 recovery, which will hinge on end-market demand cycles, customer qualification timelines, and the mass adoption of Fluxless TCB and other advanced packaging architectures.

Key Performance Indicators

Revenue
Decreasing
181.65M
QoQ: 5.57% | YoY: -4.85%
Gross Profit
Decreasing
84.73M
46.64% margin
QoQ: 16.90% | YoY: -5.87%
Operating Income
Increasing
8.28M
QoQ: 114.34% | YoY: 284.43%
Net Income
Increasing
12.26M
QoQ: 111.94% | YoY: 194.74%
EPS
Increasing
0.22
QoQ: 112.02% | YoY: 198.91%

Revenue Trend

Margin Analysis

Historical Earnings Comparison

PeriodRevenue ($M)EPS ($)YoY GrowthReport
Q2 2025 161.99 -1.59 -5.9% View
Q1 2025 166.12 1.51 -3.0% View
Q4 2024 181.32 0.22 -10.4% View
Q3 2024 181.65 0.22 -4.9% View
Q2 2024 172.07 -1.83 -0.6% View